Electronic Wet Chemicals refer to chemical reagents with a purity greater than 99.99%, used in wet processes such as wet etching, cleaning, developing, and stripping. These liquid chemical materials are primarily applied in the integrated circuit (IC), photovoltaic (PV) panel, and display panel industries. Ultra-pure reagents, internationally known as Process Chemicals, are referred to as Wet Chemicals in the United States, Europe, and Taiwan. Their purity and cleanliness are critically important for the yield, electrical performance, and reliability of electronic components.

Specialty gases mainly include high-purity gases, electronic gases, and standard gases. Electronic specialty gases (ESG) are an important branch of specialty gases, referring to gases used in the production of semiconductors, flat-panel displays, and other electronic products. These gases play key roles in multiple steps of semiconductor manufacturing, including but not limited to cleaning, etching, deposition, doping, and photolithography. Because these processes require extremely high purity and precision of materials, electronic specialty gases must meet extremely high purity standards, usually 99.999% (5N) or higher.

CMP materials refer to the various materials used in the chemical mechanical polishing (CMP) process, primarily including CMP polishing pads and CMP polishing fluids (slurries). These materials effectively flatten the surface of semiconductor wafers through chemical and mechanical polishing, preparing them for subsequent chip manufacturing processes.

Ultra-high molecular weight polyethylene is a linear-structured engineering plastic with excellent comprehensive properties. UHMWPE has extremely long molecular chains arranged in the same direction and intertwined with each other. By strengthening intermolecular interactions, these longer chains can transfer loads more efficiently to the main backbone, giving UHMWPE a very high specific modulus and specific strength.

High-strength, high-modulus polyethylene fiber, also known as Ultra-High Molecular Weight Polyethylene (UHMWPE) fiber, is currently the fiber with the highest specific strength and specific modulus in the world. It is spun from polyethylene resin with a molecular weight exceeding 1 million. UHMWPE ranks first among plastics in wear resistance, several times more wear-resistant than carbon steel and brass, and tens of times more resistant than con

Polyolefin elastomer (POE) is essentially a random copolymer of ethylene and an α-olefin, with the α-olefin content generally no less than 20%. Due to its unique two-phase microstructure, POE combines the high elasticity of rubber with excellent thermoplastic processing properties. The emergence and development of POE are closely linked to the application of metallocene catalysts and the advancement of solution polymerization technology.

Artificial Bone Regeneration Material are engineered biomaterials designed to replace, augment, or regenerate human bone tissue in orthopedic, dental, spinal, and reconstructive surgeries. Unlike autologous (patient-derived) or natural bone grafts (from human or animal donors), artificial bone is synthetically manufactured to emulate the structural, mechanical, and biological characteristics of natural bone.

Polyetheretherketone (PEEK) is a high-performance engineering plastic originally developed in 1977 by the British company ICI and industrialized in the early 1980s by Victrex, a UK-based firm. PEEK’s molecular structure contains para-methacrylate and para-phthalic anhydride side chains, features a bro

Clethodim is a post-emergence cyclohexenone herbicide that is highly safe for broadleaf crops. It effectively controls grass weeds and is less affected by environmental conditions. With broad application potential, it is the herbicide of choice for crops such as soybeans and cotton. The global Clethod